Project BriefNanoscale Subsurface Metrology (NSM)Develop a platform based on atomic force microscopy and ultrasonic microscopy to enable high-speed, non-destructive subsurface measurements of three-dimensional nanostructures in electronic device structures and nanomaterials with nanometer scale resolution. Sponsor: VEECO INSTRUMENTS INC.100 Sunnyside BoulevardWoodbury, NY 11797-2902
Modern electronic devices and nanomaterials depend critically on the size, shape, and interfaces of internal structures with dimensions less than 100 nanometers. The vast majority of these structures and interfaces are buried below a sample surface. Current metrology tools, however, do not offer high-speed, non-destructive methods of imaging the three-dimensional structure of subsurface features. Veeco Instruments has proposed developing and validating the world's first wafer scale platform for nondestructive Nanoscale Subsurface Metrology (NSM). Based on revolutionary advances in atomic force microscopy and scanning acoustic microscopy, the NSM platform will enable nondestructive imaging of critical buried nanostructures and defects with resolution exceeding 20 nm laterally and better than one nm vertically. The proposed NSM system will operate at speeds hundreds of times faster than existing technologies. NSM measurements and analyses will include the detection of internal voids and defects, and measurement of three-dimensional dispersion of nanoparticles in solids. Successful completion of this proposal could enable a new imaging and measurement platform that could improve yields in semiconductor and data storage device manufacturing, enable breakthroughs in novel nanomaterials, and accelerate a broad range of nanotechnology research.
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