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Project Brief


Open Competition 1 - Electronics and Photonics

Ultrahigh Density Scalable Digital Control of Microelectromechanical Systems


To develop high-density digital control and interfacing schemes for microelectromechanical systems (MEMS) -- making imprecise devices precise.

Sponsor: Corning IntelliSense Corporation

36 Jonspin Road
Wilmington, MA 01887
  • Project Performance Period: 11/1/2002 - 6/30/2006
  • Total project (est.): $5,665,920.00
  • Requested ATP funds: $1,999,705.00

Unlike digital circuits, MEMS structures are analog and, therefore, subject to many variations and drifts in their characteristics and undesirable non-linearities. It is widely recognized that this fundamental challenge of MEMS will inhibit widespread use. In a two-year project, Corning IntelliSense will insert an embedded digital interface and control circuit that provides a common digital interface gateway and implement control algorithms for the transparent, precise control of the MEMS. The project will apply a robust algorithm suitable for systems with uncertainties and instabilities. It also will develop an application-specific integrated circuit (ASIC) chip with a record ultrahigh control bandwidth density (10MHz/square centimeter). The ASIC will be used for precise positioning of a micromirror. In addition to MEMS digital interface and control design Corning IntelliSense will design and fabricate MEMS micromirrors. MEMS-only chips will be integrated with circuit chips using vertical interconnects. Technical risks derive from high control bandwidth density required for high accuracy and the controllability of the circuit under significant external variations. The control bandwidth density (control cycles/area/time) requirement is approximately one order of magnitude higher than anything that currently exists. Technology diffusion will be provided through the Corning IntelliSense MEMS foundry business; Corning will contribute $3.6 million (64 percent) and ATP will contribute $2 million to the project. Corning seeks to use this technology in optical communication modules. Because Corning is a major optical components supplier the benefits of this technology will be pervasive throughout the telecommunications industry. In addition to enabling optical MEMS, digitally controlled MEMS will enable other MEMS applications such as beam steering antennas, mass flow control, and drug discovery. Corning is committed to this technology development program and ATP funding will accelerate the project R&D.

For project information:
Allison Kurz, (978) 988-8000
kurzah@corning.com

ATP Project Manager
Carlos Grinspon, (301) 975-4448
carlos.grinspon@nist.gov


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