Open Competition 1 - Electronics and Photonics

Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics

Sponsor: General Electric Company

• Project Performance Period: 11/1/2002 - 10/31/2005
• Total project (est.): $7,267,520.00
• Requested ATP funds: $3,506,139.00

Continuing advances in semiconductor technology are leading to integrated circuits (chips) that are faster and packed with more transistors than ever, such that they dissipate increasing amounts of heat. The next generation of microelectronic devices will require better heat management through new technologies, such as improved thermal conductivity in the material used as an interface between a chip and the heat sink that cools the device. A joint venture led by General Electric will carry out a three-year project to develop and demonstrate the performance of heat-sink interface materials providing effective thermal conductivity 10 times higher than is currently available. To design material systems that meet all requirements for microelectronics, such as thermal conductivity combined with electrical insulating properties, the research team will use novel approaches such as nanostructured materials. The team will develop a highly heat-conducting matrix polymer, thermally conductive filler particles to integrate into the matrix, a set of predictive modeling tools relating various material combinations to thermal management, and an optimized overall system. The result will be a homogenous, defect-free composite without the voids and non-uniformities that can reduce thermal conductivity. Other project partners include Superior MicroPowders Inc. (Albuquerque, N.M.) and the State University of New York at Binghamton (Binghamton, N.Y.). The ATP funding makes it possible to bring together a team with complementary expertise in nanoparticles (Superior MicroPowders), modeling (SUNY Binghamton), and polymer technology (GE). If successful, the project will lead to significant cost savings and performance improvements in high-end electronics and give the United States an opportunity to gain ground in, and perhaps even control, the thermal interface materials market (worth $205 million in 2000), now dominated by foreign companies. In addition to potentially reducing the cost of personal computers and perhaps the size of portable electronics, the new technology could benefit many industrial sectors, including automotive, medical, military, and aerospace electronics.

For project information:

James Healy, (518) 387-6284
healyj@research.ge.com

Active Project Participants

• Cabot Corporation (formerly Superior MicroPowders, LLC) (Albuquerque, NM)
  [Original, Active Member]
  
• State University of New York (SUNY) at Binghamton (Binghamton, NY)
  [Original, Active Member]
  

ATP Project Manager

Gerald Castellucci, (301) 975-2435
gerald.castellucci@nist.gov